Plasma Etching Gases and Etched Materials (Table 3)
Material | Gas |
---|---|
Silicon | |
Polysilicon (Si) and Silicon | CF + O2, CCL3 or CF3Cl, CF4 and HCl |
Silicon Dioxide (SiO2) | C2F6, C3F8, CF4, SiF4, C5F12, CHF3, CCl2F2, SF6, HF |
Silicon Nitride (Si3N4) | CF4 + Ar, CF4 + O2, CF4 + H2 |
Metals | |
Aluminum (Al) | CCl4 or BCl3 + He or Ar |
Chromium (Cr) | CCl4 |
Chromium Oxide (CrO3) | Cl2 + Ar or CCl4 + Ar |
Gallium Arsenide (GaAs) | CCl2F2 |
Vanadium (V) Titanium (Ti) Tantalum (Ta) Molybdenum (Mo) Tungsten (W) |
CF4 |